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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 tsz22111 ? 14? 001 www.rohm.com datashee t cmos ldo regulators for automotive equipments 1ch 200ma cmos ldo regulators buxxsd2-m series general description buxxsd2-m series are high-performance cmos ldo regulators with output current ability of up to 200-ma. these devices have excellent noise and load response characteristics despite of its low circuit current consumption of 33a. they are most appropriate for various applications such as power supplies for logic ic, rf, and camera modules. features ? high output voltage accuracy: 2.0% (in all recommended conditions) ? high ripple rejection: 68 db (typ, 1 khz,) ? compatible with small ceramic capacitor (cin=cout=0.47 f) ? low current consumption: 33 a ? output voltage on/off control ? built-in over current protection circuit (ocp) ? built-in thermal shutdown circuit (tsd) ? package ssop5 is similar to sot23-5(jedec) applications ? automotive equipments. ? portable devices ? camera modules ? other electronic devices using microcontrollers or logic circuits ? aec-q100 qualified key specifications ? input power supply voltage range: 1.7v to 6.0v ? output current range: 0 to 200ma ? operating temperature range: -40 to +105 ? output voltage lineup: 1.2v,1.5v,1.8v,2.5v 2.8v,3.0v,3.3v ? output voltage accuracy: 2.0% ? circuit current: 33a(typ.) ? standby current: 0 a (typ.) package w(typ.) x d(typ.) x h(max.) ssop5 2.90mm x 2.80mm x 1.25mm typical application circuit figure 1. typical application circuit vin cin cout vout vin vout stby gnd on off buxxsd2mg-m vin cin cout vout vin vout stby gnd on off buxxsd2mg-m vin cin cout vout vin vout stby gnd on off buxxsd2mg-m buxxsd2-m
datasheet datasheet 2/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series figure 2. block diagram cin(min)=0.47 f (ceramic) cout(min)=0.47 f (ceramic) pin configuration pin description pin no. symbol function 1 vin input pin 2 gnd gnd pin 3 stby output control pin (high:on, low:off) 4 n.c. no connect 5 vout output pin block diagram lot. no marking vout n.c. vin gnd stby 1 3 5 2 cin vin gnd stby vstby vout vout cout vref stby tsd vin n.c. 4 ocp
datasheet datasheet 3/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series absolute maximum ratings parameter symbol rating unit maximum power supply voltage range v max -0.3 to +6.5 v power dissipation pd 540 (*1) mw maximum junction temperature tjmax +125 operating temperature range topr -40 to +105 storage temperature range tstg -55 to +125 (*1) derate by 5.6mw/ when operating above ta=25 .(when mounted on a board 70mm 70mm 1.6mm glass-epoxy board, two layer) recommended operating ratings parameter symbol limit unit input power supply voltage range v in 1.7 to 6.0 v maximum output current i max 200 ma recommended operating conditions rating parameter symbol min. typ. max. unit conditions input capacitor cin 0.47 (*2) 1.0 f a ceramic capacitor is recommended. output capacitor cout 0.47 (*2) 1.0 f a ceramic capacitor is recommended. (*2) set the value of the capacitor so t hat it does not fall below the minimum value. take into consideration the temperature characteristics, dc device characteristics, and degradation with time.
datasheet datasheet 4/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series electrical characteristics (unless otherwise noted, ta=-40 to 105 , v in =v out +1.0v (*3) , v stby =1.5v, cin=1 f, cout=1 f. ) limit parameter symbol min. typ. max. unit conditions output voltage v out v out 0.98 v out v out 1.02 v i out =0 to 200ma, v out R 2.5v, v in =v out +0.5 to 6.0v v out 2.5v, v in =3.0 to 6.0v ta=-40 to +105 (*4,5,6) - 4 10 mv i out =10ma v out Q 2.5v, v in =3.0 to 6.0v line regulation v dli 6 15 mv i out =10ma v out 2.5v, v in =v out +0.5 to 6.0v load regulation1 v dlo1 - 0.5 5 mv i out =1 to 100ma load regulation2 v dlo2 - 1 10 mv i out =1 to 200ma - 400 700 mv 1.0v Qv out 1.2v, i out =100ma - 280 550 mv 1.2v Qv out 1.5v, i out =100ma - 180 370 mv 1.5v Qv out 1.7v, i out =100ma - 150 290 mv 1.7v Qv out 2.1v, i out =100ma - 110 220 mv 2.1v Qv out 2.5v, i out =100ma - 100 180 mv 2.5v Qv out 2.8v, i out =100ma dropout voltage v drop - 85 150 mv 2.8v Qv out , i out =100ma maximum output current i omax 200 - - ma v in =v out +1.0v (*3) limit current i lmax 250 400 - ma vo=v out 0.98, ta=25 short current i short - 100 200 ma vo=0v, ta=25 circuit current i gnd - 33 80 a i out =0ma circuit current (stby) i ccst - - 2.0 a v stby =0v ripple rejection ratio r.r. - 68 - db v rr =-20dbv,f rr =1khz,i out =10ma load transient response v lot - 65 - mv i out =1 to 150ma,trise=tfall=1s, v in =v out +1.0v (*5) line transient response v lit - 5 - mv v in =v out +0.5 to v out +1.0v, trise=tfall =10s output noise voltage v nois - 30 - vrms bandwidth 10 to 100khz startup time t st - 100 300 sec output voltage settled within tolerances (*7) on v stbh 1.1 - v in v stby control voltage off v stbl -0.2 - 0.5 v stby pin current i stby - - 4.0 a ta = 2 5 (*3) v in =3.5v for v out 2.5v. (*4) operating conditions are limited by pd. (*5) typical values apply for ta=25 . (*6) v in =3.0v to 6.0v for v out 2.5v. (*7) startup time=time from en assertion to v out 0.98
datasheet datasheet 5/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) 0 5 10 15 20 25 30 35 40 45 50 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) circuit current i gnd ( a) 1.15 1.16 1.17 1.18 1.19 1.20 1.21 1.22 1.23 1.24 1.25 0 50 100 150 200 output current i out (ma) output voltage v out (v) 1.15 1.16 1.17 1.18 1.19 1.20 1.21 1.22 1.23 1.24 1.25 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) figure 3. output voltage vs. input voltage figure 4. line regulation figure 5. circuit current vs. input voltage figure 6. load regulation t a =25 v in =v stb y t a =25 v in =v stb y v in =v stby i out =0ma v in =3.5v v stby =1.5v ta=105 ta=25 ta=-40 ta=25 ta=105 ta=-40 i out =0ma i out =50ma i out =200ma i out =0ma i out =50ma i out =200ma
datasheet datasheet 6/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature t a ( ) circuit current i gnd ( a) 0 10 20 30 40 50 60 70 80 90 100 0 50 100 150 200 output current i out (ma) circuit current i gnd ( a) 1.15 1.16 1.17 1.18 1.19 1.20 1.21 1.22 1.23 1.24 1.25 -40 -20 0 20 40 60 80 100 temperature t a ( ) output voltage v out (v) 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0 100 200 300 400 500 output current i out (ma) output voltage v out (v) figure 7. circuit current vs. output current figure 8. ocp threshold figure 9. output voltage vs. temperature fi gure 10. circuit current vs. temperature v in =3.5v v stby =1.5v t a =25 v stb y =1.5v v in =3.5v v stby =1.5v i out =0.1ma v in =3.5v v stby =1.5v i out =0.1ma ta=105 ta=25 ta=-40 v in =6.0v v in =3.5v v in =3.0v
datasheet datasheet 7/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40-20 0 20406080100 temperature t a () circuit current at stby i ccst (na) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 stby pin voltage v stby (v) stby pin current i stby ( a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.00 0.25 0.50 0.75 1.00 1.25 1.50 stby pin voltage v stby (v) output voltage v out (v) figure 11. stby threshold figure 12. circu it current ( at stby) vs. temperature figure 13. stby pin current vs. stby pin voltage v in =3.5v i out =0.1ma v in =6.0v v stby =0v ta=105 ta=25 ta=-40 ta=105 ta=25 ta=-40
datasheet datasheet 8/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 100 1000 10000 100000 frequency (hz) ripple rejection ratio r.r. (db) 0 5 10 15 20 25 30 35 40 45 50 0 50 100 150 200 output current i out (ma) output noise voltage v nois ( vrms ) figure 14. ripple rejection ratio vs. frequency ta = 2 5 v in =3.5v v rr =-20dbv v stby =1.5v i out =10ma cin=cout=1f figure 15. output noise vo ltage vs. output current 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output spectral noise density ( v/hz ) figure 16.output spectral noise density vs. frequency ta = 2 5 v in =3.5v v stby =1.5v cin=cout=1f bndwidth 10 to 100khz ta = 2 5 v in =3.5v v stby =1.5v i out =10ma cin=cout=1 f
datasheet datasheet 9/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) v out i out =10ma 1.19 1.21 1.20 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 6.0v slew rate 1v/ s cin=cout=1.0 f v out i out =10ma 1.19 1.21 1.20 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 3.5v slew rate 1v/ s cin=cout=1.0 f v in =3.5v,v stby =1.5v v out i out 1ma 150ma tris e tfall=1 s, cin=cout=1 f 100ma/div 100mv/div 20 s/div 0 200 100 output current(ma) 1.10 1.30 1.20 output volatage(v) v in =3.5v,v stby =1.5v v out i out 1ma 100ma 100ma/div 100mv/div 1.10 1.30 1.20 output volatage(v) 20 s/div tris e tfall=1 s, cin=cout=1 f 0 200 100 output current(ma) figure 19. line transient response (3.0 to 3.5v) figure 20. line transient response (3.0 to 6.0v) figure 18. load response (1ma to 150ma) figure 17. load response (1ma to 100ma)
datasheet datasheet 10/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu12sd2mg-m (unless otherwise specified, ta=25 .) v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 20 s/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 400ms/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div figure 21. startup time (r out =none) figure 22. startup time (r out =6 ) figure 23. discharge time (r out =none) figure 24. discharge time (r out =6 )
datasheet datasheet 11/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) circuit current i gnd ( a) 1.75 1.76 1.77 1.78 1.79 1.80 1.81 1.82 1.83 1.84 1.85 0 50 100 150 200 output current i out (ma) output voltage v out (v) 1.75 1.76 1.77 1.78 1.79 1.80 1.81 1.82 1.83 1.84 1.85 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) figure 25. output voltage vs. input voltage figure 26. line regulation figure 27. circuit current vs. input voltage figure 28. load regulation t a =25 v in =v stby t a =25 v in =v stby v in =v stby i out =0ma v in =3.5v v stby =1.5v ta=105 ta=25 ta=-40 ta=25 ta=-40 ta=105 i out =0ma i out =50ma i out =200ma i out =0ma i out =50ma i out =200ma
datasheet datasheet 12/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature t a () circuit current i gnd ( a) 0 10 20 30 40 50 60 70 80 90 100 0 50 100 150 200 outut current i out (ma) circuit current i gnd ( a) 1.75 1.76 1.77 1.78 1.79 1.80 1.81 1.82 1.83 1.84 1.85 -40 -20 0 20 40 60 80 100 temperature t a () output voltage v out (v) 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 0 100 200 300 400 500 output current i out (ma) output voltage v out (v) figure 29. circuit current vs. output current figure 30. ocp threshold figure 31. output voltage vs. temperature fi gure 32. circuit current vs. temperature v in =3.5v v stby =1.5v t a =25 v stby =1.5v v in =3.5v v stby =1.5v i out =0.1ma v in =3.5v v stby =1.5v i out =0.1ma ta=105 ta=25 ta=-40 v in =6.0v v in =3.5v v in =3.0v
datasheet datasheet 13/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature t a () circuit current at stby i ccst (na) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 stby pin voltage v stby (v) stby pin current i stby ( a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 stby pin voltage v stby (v) output voltage v out (v) figure 33. stby threshold figure 34. circu it current (at stby) vs. temperature figure 35. stby pin current vs. stby pin voltage v in =3.5v i out =0.1ma v in =6.0v v stby =0v ta=105 ta=25 ta=-40 ta=105 ta=25 ta=-40
datasheet datasheet 14/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 100 1000 10000 100000 frequency (hz) ripple rejection ratio r.r. (db) 0 5 10 15 20 25 30 35 40 45 50 0 50 100 150 200 output current i out (ma) output noise voltage v nois ( vrms ) figure 36. ripple rejection ratio vs. frequency ta = 2 5 v in =3.5v v rr =-20dbv v stby =1.5v i out =10ma cin=cout=1 f figure 37. output noise vo ltage vs. output current ta = 2 5 v in =3.5v v stby =1.5v cin=cout=1 f bndwidth 10 to 100khz figure 38.output spectral noise density vs. frequency 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output spectral noise density ( v/hz ) ta = 2 5 v in =3.5v v stby =1.5v i out =10ma cin=cout=1 f
datasheet datasheet 15/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) v out i out =10ma 1.79 1.81 1.80 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 6.0v slew rate 1v/ s cin=cout=1.0 f v out i out =10ma 1.79 1.81 1.80 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 3.5v slew rate 1v/ s cin=cout=1.0 f v in =3.5v,v stby =1.5v v out i out 1ma 150ma tris e tfall=1 s, cin=cout=1 f 100ma/div 100mv/div 20 s/div 0 200 100 output current(ma) 1.70 1.90 1.80 output volatage(v) v in =3.5v,v stby =1.5v v out i out 1ma 100ma 100ma/div 100mv/div 1.70 1.90 1.80 output volatage(v) 20 s/div tris e tfall=1 s, cin=cout=1 f 0 200 100 output current(ma) figure 41. line transient response (3.0 to 3.5v) figure 42. line transient response (3.0 to 6.0v) figure 39. load response (1ma to 100ma) figure 40. load response (1ma to 150ma)
datasheet datasheet 16/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu18sd2mg-m (unless otherwise specified, ta=25 .) v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 20 s/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 400ms/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div figure 43. startup time (r out =none) figure 44. startup time (r out =9 ) figure 45. discharge time (r out =none) figure 46. discharge time (r out =9 )
datasheet datasheet 17/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) circuit current i gnd ( a) 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 0 50 100 150 200 output current i out (ma) output voltage v out (v) 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 input voltage v in (v) output voltage v out (v) figure 47. output voltage vs. input voltage figure 48. line regulation figure 49. circuit current vs. input voltage figure 50. load regulation t a =25 v in =v stby t a =25 v in =v stby v in =v stby i out =0ma v in =3.5v v stb y =1.5v ta=105 ta=25 ta=-40 ta=25 ta=-40 ta=105 i out =0ma i out =50ma i out =200ma i out =0ma i out =50ma i out =200ma
datasheet datasheet 18/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature t a () circuit current i gnd ( a) 0 10 20 30 40 50 60 70 80 90 100 0 50 100 150 200 outut current i out (ma) circuit current i gnd ( a) 2.45 2.46 2.47 2.48 2.49 2.50 2.51 2.52 2.53 2.54 2.55 -40 -20 0 20 40 60 80 100 temperature t a () output voltage v out (v) 0.00 0.50 1.00 1.50 2.00 2.50 3.00 0 100 200 300 400 500 output current i out (ma) output voltage v out (v) figure 51. circuit current vs. output current figure 52. ocp threshold figure 53. output voltage vs. temperature fi gure 54. circuit current vs. temperature v in =3.5v v stb y =1.5v t a =25 v stby =1.5v v in =3.5v v stby =1.5v i out =0.1ma v in =3.5v v stby =1.5v i out =0.1ma ta=105 ta=25 ta=-40 v in =3.0v v in =6.0v v in =3.5v
datasheet datasheet 19/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) 0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 temperature t a () circuit current at stby i ccst (na) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 stby pin voltage v stby (v) stby pin current i stby ( a) 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 output current i out (ma) dropout voltage v drop (mv) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 stby pin voltage v stby (v) output voltage v out (v) figure 55. stby threshold figure 56. circu it current ( at stby) vs. temperature figure 57. stby pin current vs. stby pin voltage figure 58. dropout voltage vs. output current v in =3.5v i out =0.1ma v in =6.0v v stby =0v v in =0.98*vout v stby =1.5v ta=105 ta=25 ta=-40 ta=105 ta=25 ta=-40 ta=105 ta=25 ta=-40
datasheet datasheet 20/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) 0 5 10 15 20 25 30 35 40 45 50 0 50 100 150 200 output current i out (ma) output noise voltage v nois ( vrms ) 0 10 20 30 40 50 60 70 80 90 100 100 1000 10000 100000 frequency (hz) ripple rejection ratio r.r. (db) figure 59. ripple rejection ratio vs. frequency ta = 2 5 v in =3.5v v rr =-20dbv v stby =1.5v i out =10ma cin=cout=1 f figure 60. output noise vo ltage vs. output current 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) output spectral noise density ( v/hz ) figure 61.output spectral noise density vs. frequency ta = 2 5 v in =3.5v v stby =1.5v cin=cout=1 f bndwidth 10 to 100khz ta = 2 5 v in =3.5v v stby =1.5v i out =10ma cin=cout=1 f
datasheet datasheet 21/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) v out i out =10ma 2.49 2.51 2.50 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 6.0v slew rate 1v/ s cin=cout=1.0 f v out i out =10ma 2.49 2.51 2.50 output volatage(v) 1ms/div v in =v stby 10mv/div 1.0v/div 0.0 2.0 1.0 3.0 input voltage(v) 3.0v 3.5v slew rate 1v/ s cin=cout=1.0 f v in =3.5v,v stby =1.5v v out i out 1ma 150ma tris e tfall=1 s, cin=cout=1 f 100ma/div 100mv/div 20 s/div 0 200 100 output current(ma) 2.40 2.60 2.50 output volatage(v) v in =3.5v,v stby =1.5v v out i out 1ma 100ma 100ma/div 100mv/div 2.40 2.60 2.50 output volatage(v) 20 s/div tris e tfall=1 s, cin=cout=1 f 0 200 100 output current(ma) figure 64. line transient response (3.0 to 3.5v) figure 65. line transient response (3.0 to 6.0v) figure 62. load response (1ma to 100ma) figure 63. load response (1ma to 150ma)
datasheet datasheet 22/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series reference data bu25sd2mg-m (unless otherwise specified, ta=25 .) v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 20 s/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 1.0v/div 0.0 2.0 1.0 output volatage(v) 400ms/div v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div v stby v out cout=0.47 f cout=1.0 f cout=2.2 f 0.0 2.0 1.0 output volatage(v) v in =3.5v 0v 1.5v 0.0 2.0 1.0 stby pin voltage(v) 1.0v/div 20 s/div 1.0v/div figure 66. startup time (r out =none) figure 67. startup time (r out =12.5 ) figure 68. discharge time (r out =none) figure 69. discharge time (r out =12.5 )
datasheet datasheet 23/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series figure 71. stability area characteristics (example) input/output capacitor it is recommended that an input capacitor is placed near pins between the vcc pin and gnd as well as an output capacitor between the output pin and gnd. the input is valid when the power supply impedance is high or when the pcb trace has significant length. for the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. however, please check the actual functionality of this capacitor by mounting it on a board for the actual application. ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. for additional details, please check with the manufacturer, and select the best ceramic capacitor for your application equivalent series resistance (esr) of a ceramic capacitor capacitors generally have esr (equivalent series resistance) and it operates stably in the esr-i out area shown on the right. since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different esr, please check the esr of the capacitor to be used and use it within the stability area range shown in the right grap h for evaluation of the actual application. capacity value of ceramic capacitor - dc bias characteristics ( example ) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 00.511.522.533.54 dc bias voltage [v] capacitance change [%] 10-v withstand voltag e b1char acter istics grm 188b11a105ka61d 10-v withstand voltag e b char acter istics 6.3- v withstand voltag e b char acter istics 4-v withstand voltag e x6s characteristics 10-v withstand voltag e f char acter istics 10- v withstand voltag e f char acter istics figure 70. capacity-bias characteristics 0.01 0.1 1 10 100 0 50 100 150 200 i out [ma] esr[ ? ] stable region cin=cout=0.47 f ta=-40 to 105 stable region unstable region
datasheet datasheet 24/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series power dissipation (pd) as for power dissipation, an estimate of heat reduction characte ristics and internal power consumption of ic are shown, so please use these for reference. since power dissipation chang es substantially depending on t he implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the power dissipation of ic may lead to deterioration of the original ic performance, such as causing the operation of the thermal shut down circuit or reduction in current capa bility. therefore, be sure to prepare sufficient margin within power dissipation for usage. calculation of the maximum internal power consumption of ic (pmax) p max =(v in -v out )i omax where : v in =input voltage v out = output voltage i omax : maximum output current) measurement conditions standard rohm board top layer (top view) layout of board for measurement ic implementation position bottom layer (top view) measurement state with board im plemented (wind speed 0 m/s) board material glass epoxy resin (double-side board) board size 70 mm x 70 mm x 1.6 mm top layer metal (gnd) wiring rate: approx. 0% wiring rate bottom layer metal (gnd) wiring rate: approx. 50% through hole diameter 0.5mm x 6 holes power dissipation 0.54w thermal resistance ja=185.2 /w * please design the margin so that pmax is less than pd (p max < pd) within the usage temperature range figure 72. ssop5 power dissipation heat reduction characteristics (reference) 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 ta () pd (w) 0.54w 105 standard rohm board
datasheet datasheet 25/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series i/o equivalence circuits 5pin (vout) 2pin (gnd) 3pin (stby) 1pin (vin) figure 73. input / output equivalent circuit vout vin vout vin
datasheet datasheet 26/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series operational notes 1) absolute maximum ratings this product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. in addition, it is impossible to predict a ll destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a spec ial mode exceeding the absolute maximum ratings. 2) gnd potential gnd potential must be the lo west potential of all pins of the ic at all o perating conditions. ensure that no pins are at a voltage below the ground pin at any ti me, even during transient condition. 3) setting of heat carry out the heat design that have adequate marg in considering pd of actual working states. 4) pin short and mistake fitting when mounting the ic on the pcb, pay attention to the orientat ion of the ic. if there is mistake in the placement, the ic may be burned up. 5) actions in strong magnetic field using the ic within a strong magnetic field may cause the ic to malfunction. 6) mutual impedance use short and wide wiring tracks for the power supply and gr ound to keep the mutual impedance as small as possible. use a capacitor to keep ripple to a minimum. 7) stby pin voltage to enable standby mode for all channels, set the stby pin to 0.5 v or less, and for normal operation, to 1.1 v or more. setting stby to a voltage between 0.5 and 1.1 v may cause malfunction and should be avoided. keep transition time between high and low (or vice versa) to a minimum. additionally, if stby is shorted to vin, the ic will swit ch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. if the ic is switc hed on again while this voltage is present, overshoot may occur on the output. theref ore, in applications where these pins are shorted, the out put should always be completely discharged before turning the ic on. 8) over current protection circuit over current and short circuit protection is built-in at the output, and ic destructi on is prevented at the time of load short circuit. these protection circuits are effective in the destructive prevention by su dden accidents, please avoid applications to where the over current protection circuit operates continuously. 9) thermal shutdown this ic has thermal shutdown circuit (tsd circuit). when the temperature of ic chip is higher than 175 , the output is turned off by tsd circuit. tsd circuit is only designed for protecting ic from thermal over load. therefore it is not recommended that you design application where tsd will work in normal condition. 10) actions under strong light a strong light like a halogen lamp may be caused malfunction. in our testing, fluorescenc e light and white led causes little effects for the ic, but infrared li ght causes strong effects on the ic. the ic should be shielded from light like sunrays or halogen lamps. 11) output capacitor to prevent oscillation at output, it is recommended that th e ic be operated at the stable region shown in figure 71. it operates at the capacitance of more than 0.47 f. as capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved.
datasheet datasheet 27/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series ordering information physical dimension tape and reel information marking diagram xx output voltage marking 12 1.2v typ. m3 15 1.5v typ. nv 18 1.8v typ. m4 25 2.5v typ. m5 28 2.8v typ. nw 30 3.0v typ. nx 33 3.3v typ. ny part number marking ssop5(top view) lot number direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) ssop5 2.90.2 0.13 4 + 6 ?4 1.6 2.80.2 1.10.05 0.050.05 +0.2 ?0.1 +0.05 ?0.03 0.42 +0.05 ?0.04 0.95 5 4 12 3 1.25max. 0.2min. 0.1 s s rohm part no. output voltage xx=1 2 :1 .2 v xx= 15:1.5v xx= 18:1.8v xx= 25:2.5v xx= 28:2.8v xx= 30:3.0v xx= 33:3.3v 2 bu x grade m;autom otive accessories package g: ssop5 series name sd2m:high-speed load response low nois e shutdown sw packaging and forming specifications tr:embossed tape and reel (ssop5) xs r -mt mg d
datasheet datasheet 28/28 tsz02201-0rbr0a300020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2013.03.19 rev.002 www.rohm.com tsz22111 ? 15? 001 buxxsd2-m series revision history date revision changes 21.dec.2012 001 new release 19.mar.2013 002 1) 4 devices (1.5v,2.8v,3.0v,3.3v) ar e added to the output voltage lineup. 2) some graphs are added to the reference data.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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